i demontaż komponentów wymagania elektryczne żelazko
Przygotowania przed spawanie
1. Get rid of the oxide layer and remove the oxide layer so that the tip of the soldering iron can be easily dipped in solder when soldering. Before using the electric soldering iron, use a knife or file to gently remove the oxide layer on the tip of the soldering iron. After the oxide layer is scraped off, the metal will be exposed luster.
2. Dip in flux. As pokazano in Rysunek b, after the oxide layer of the solder iron tip is removed, power on the soldering iron to heat the tip of the solder iron, and then dip the tip of the solder iron in kalafonia (it is available in the electronic market, do not go to the vegetable market), and you will see kalafonia vapor on the tip of the soldering żelazo. (Pacjenci z obsesyjno-kompulsywny zaburzenie puszka test test temperatura z ich twarze. Kiedy ja byłem a dziecko, every time my dad soldered the circuit board of the remote control with a soldering iron, I wanted to try: the temperature the the smoking solder tip)
3. Hang cyna. Kiedy końcówka z żelazo jest zanurzone w kalafonia i osiąga a wystarczająca temperatura, kalafonia para wynurze z końcówka żelazo, zastosuj to głowica z żelazo końcówka, and zastosuj a warstwa z do końcówka końcówka żelazo końcówka końcówka żelazo końcówka.
4. spawanie z komponentów
When soldering components, first gently scrape off the oxide layer on the pins of the components to be soldered, then energize the soldering iron, dip it in rosin after heating, when the temperature of the soldering iron tip is sufficient, turn the soldering iron tip at a 45 degree angle Press on the copper foil next to the pins of the components to be soldered on the printed circuit board, and then touch the solder wire to the tip of the soldering iron. After the solder wire melts, it will become liquid and flow around the pins of the components. When the solder is turned on, the solder cooling will weld the component pins and the copper foil of the printed circuit board together.
Kiedy komponenty, żelazo końcówka powinno nie być kontakt z drukowany obwód płytka i komponenty dla zbyt długi, tak jak nie do uszkodzenia te wydrukowane obwód płytka i komponenty. Spawanie proces powinien być zakończony w ciągu 1,5 do 4 sekund. The solder joint should be smooth and the solder should be równomiernie rozprowadzony. (The old driver takes me)
5. Demontaż z komponentów
When disassembling the components on the printed circuit board, use the tip of the electric soldering iron to touch the solder joints at the component pins. After the solder at the solder joints melts, pull out the component pins on the other side of the circuit board. , and then solder another pin in the same way. This method is very convenient to disassemble components with less than 3 pins, but it is more difficult to disassemble components with more than 4 pins (such as integrated circuits).
